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WLK 5
* thermally conductive, electrically not conductive
* thermal conductivity: 0,836W/mK
* glue layer: epoxide
* composition: resin and hardener separated
* mixture proportion 10:1
* specific thermal resistance: 120°C cm/W
* pass resistance: 1016W/cm
* temperature range: -56....+149°C
* hardening time, approx. at 190°C: 30min.
* hardening time, approx. at 38°C: 6h
* hardening time, approx. at 20°C: 16...24h
* by Fischer
2-component thermally adhesives
* to permanet bonding for heatsink and semiconductor* thermally conductive, electrically not conductive
* thermal conductivity: 0,836W/mK
* glue layer: epoxide
* composition: resin and hardener separated
* mixture proportion 10:1
* specific thermal resistance: 120°C cm/W
* pass resistance: 1016W/cm
* temperature range: -56....+149°C
* hardening time, approx. at 190°C: 30min.
* hardening time, approx. at 38°C: 6h
* hardening time, approx. at 20°C: 16...24h
* by Fischer
