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WLK 30
2-component thermally adhesives
• to permanent bonding for heatsink and semiconductor
• thermally conductive, electrically not conductive
• thermal conductivity: 0,836W/mK
• glue layer: epoxide
• composition: resin and hardener separated
• mixture proportion 10:1
• specific thermal resistance: 120°C cm/W
• pass resistance: 1016W/cm
• temperature range: -56 to +149°C
• hardening time, approx. at 190°C: 30min.
• hardening time, approx. at 38°C: 6h
• hardening time, approx. at 20°C: 16 to 24h
• by Fischer
