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• is a applied between components that may overheat and heat sinks to ensure rapid heat transfer
• combines the properties of silicone rubber pads with those of a conventional heat transfer paste, and can be used as a low bond strength adhesive, sealant or gasketing compound
• good chemical resistance
• good electrical insulation characteristics
• moisture cure
• thermal conductivity: 1.7W/mK
• colour: white
• tensile strength: 2MPa
• elongation at break: 300%
• temperature range (short term): -50...+200°C (250°C)
• specific gravity/density: 2.3g/ml
• dielectric strength: >8kV/mm
• electrical insulation: 1x1014W/cm
• skin forming rate: 10...15min.
• cure time (20°C): 24h