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HTSP 50ml
* silicone based heat transfer paste
* excellent non-creep properties
* superior thermal conductivity of 3.0W/mK
* wide operating temperature range
* low evaporation weight loss
* colour: white
* base: silicone oil
* thermo-conductive components: powdered metal oxides
* density (20°C): 3g/cm³
* temperature range: -50...+200°C
* thermal conductivity: 3W/mK
* weight loss (96h, 100°C): 0.8%
* specific resistance: 1x1015Ω/cm
* dielectric strength: 18kV/mm
silicon based heat transfer compound 3W/mK
* for efficient and reliable thermal coupling of electrical and electronic components.* silicone based heat transfer paste
* excellent non-creep properties
* superior thermal conductivity of 3.0W/mK
* wide operating temperature range
* low evaporation weight loss
* colour: white
* base: silicone oil
* thermo-conductive components: powdered metal oxides
* density (20°C): 3g/cm³
* temperature range: -50...+200°C
* thermal conductivity: 3W/mK
* weight loss (96h, 100°C): 0.8%
* specific resistance: 1x1015Ω/cm
* dielectric strength: 18kV/mm
