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Manufacturers

HTSP 1 kg

silicon based heat transfer compound 3W/mK

• for efficient and reliable thermal coupling of electrical and electronic components.
• silicone based heat transfer paste
• excellent non-creep properties
• superior thermal conductivity of 3.0W/mK
• wide operating temperature range
• low evaporation weight loss
• colour: white
• base: silicone oil
• thermo-conductive components: powdered metal oxides
• density (20°C): 3g/cm³
• temperature range: -50...+200°C
• thermal conductivity: 3W/mK
• weight loss (96h, 100°C): 0.8%
• specific resistance: 1x1015Ω/cm
• dielectric strength: 18kV/mm

HTSP01K, Electrolube thermal compounds, containing silicone, 3W/mK, HTSP series

HTSP 1 kg

251142 HTSP 1 kg HTSP01K HTSP01K silicon based heat transfer compound 3W/mK. * for efficient and reliable thermal coupling of electrical and electronic components.* silicone based heat transfer paste* excellent non-creep properties* superior thermal conductivity of 3.0W/mK* wide operating temperature range* low evaporation weight loss* colour: white* base: silicone oil* thermo-conductive components: powdered metal oxides* density (20°C): 3g/cm³* temperature range: -50...+200°C* thermal conductivity: 3W/mK* weight loss (96h, 100°C): 0.8%* specific resistance: 1x1015Ω/cm* dielectric strength: 18kV/mm

Specifications

manufacturer
Manufacturer's name HTSP01K
Data Sheet

Unit price

314,99 €

Stock: 0
Further delivery:
CW 37/2025

Minimum order quantity 4 units or
multiples of 4.