> Passive elements>Heatsinks>Heat transfer compounds>Electrolube thermal compounds, silicone-free, 3W/mK, HTCP series>HTCP 20ml

Manufacturers

HTCP 20ml
* heat transfer compound for efficient and reliable thermal coupling of electrical and electronic components
* does not contain any silicone and is therefore suitable in applications where the use of silicone in a product is prohibited
* silicone-free thermal pastes
• excellent thermal conductivity: 2.5 W/mk
* excellent non-creep characteristics
* colour: white
* base: blend of synthetic fluids
* thermo-conductive components: powdered metal oxides
* density (20°C): 3g/cm²
* temperature range: -50...+130°C
* thermal conductivity: 2.5W/mK
* weight loss (96h, 100°C): 1%
* specific resistance: 1x1014Ω/cm
* dielectric strength: 42kV/mm
HTCP 20ml

HTCP 20ml

30084 HTCP 20ml HTCP20S HTCP20S * heat transfer compound for efficient and reliable thermal coupling of electrical and electronic components* does not contain any silicone and is therefore suitable in applications where the use of silicone in a product is prohibited* silicone-free thermal pastes• excellent thermal conductivity: 2.5 W/mk* excellent non-creep characteristics* colour: white* base: blend of synthetic fluids* thermo-conductive components: powdered metal oxides* density (20°C): 3g/cm²* temperature range: -50...+130°C* thermal conductivity: 2.5W/mK* weight loss (96h, 100°C): 1%* specific resistance: 1x1014Ω/cm* dielectric strength: 42kV/mm

Specifications

manufacturer
Manufacturer's name HTCP20S
Data Sheet

Unit price

32,69 €

Stock: 22
Further delivery:
CW 14/2025