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Manufacturers

HTCP 20ml

• heat transfer compound for efficient and reliable thermal coupling of electrical and electronic components
• does not contain any silicone and is therefore suitable in applications where the use of silicone in a product is prohibited
• silicone-free thermal pastes
• excellent thermal conductivity: 2.5 W/mk
• excellent non-creep characteristics
• colour: white
• base: blend of synthetic fluids
• thermo-conductive components: powdered metal oxides
• density (20°C): 3g/cm²
• temperature range: -50...+130°C
• thermal conductivity: 2.5W/mK
• weight loss (96h, 100°C): 1%
• specific resistance: 1x1014Ω/cm
• dielectric strength: 42kV/mm

HTCP 20ml

HTCP 20ml

30084 HTCP 20ml HTCP20S HTCP20S * heat transfer compound for efficient and reliable thermal coupling of electrical and electronic components* does not contain any silicone and is therefore suitable in applications where the use of silicone in a product is prohibited* silicone-free thermal pastes• excellent thermal conductivity: 2.5 W/mk* excellent non-creep characteristics* colour: white* base: blend of synthetic fluids* thermo-conductive components: powdered metal oxides* density (20°C): 3g/cm²* temperature range: -50...+130°C* thermal conductivity: 2.5W/mK* weight loss (96h, 100°C): 1%* specific resistance: 1x1014Ω/cm* dielectric strength: 42kV/mm

Specifications

manufacturer
Manufacturer's name HTCP20S
Data Sheet

Unit price

24,39 €

Stock: 0
Next incoming goods:
CW 29/2025
9 units

Further delivery:
CW 37/2025