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Electrolube thermal compounds, silicone-free, 3W/mK, HTCP series
• heat transfer compound for efficient and reliable thermal coupling of electrical and electronic components
• does not contain any silicone and is therefore suitable in applications where the use of silicone in a product is prohibited
• silicone-fr...
• heat transfer compound for efficient and reliable thermal coupling of electrical and electronic components
• does not contain any silicone and is therefore suitable in applications where the use of silicone in a product is prohibited
• silicone-free thermal pastes
• excellent thermal conductivity: 2.5 W/mk
• excellent non-creep characteristics
• colour: white
• base: blend of synthetic fluids
• thermo-conductive components: powdered metal oxides
• density (20°C): 3g/cm²
• temperature range: -50...+130°C
• thermal conductivity: 2.5W/mK
• weight loss (96h, 100°C): 1%
• specific resistance: 1x1014Ω/cm
• dielectric strength: 42kV/mm
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Product Stock Unit price Volume discounts -
24,39 €