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Electrolube thermal compounds, silicone-free, 3W/mK, HTCP series
* heat transfer compound for efficient and reliable thermal coupling of electrical and electronic components
* does not contain any silicone and is therefore suitable in applications where the use of silicone in a product is prohibited
* silicone-fr...
* heat transfer compound for efficient and reliable thermal coupling of electrical and electronic components
* does not contain any silicone and is therefore suitable in applications where the use of silicone in a product is prohibited
* silicone-free thermal pastes
• excellent thermal conductivity: 2.5 W/mk
* excellent non-creep characteristics
* colour: white
* base: blend of synthetic fluids
* thermo-conductive components: powdered metal oxides
* density (20°C): 3g/cm²
* temperature range: -50...+130°C
* thermal conductivity: 2.5W/mK
* weight loss (96h, 100°C): 1%
* specific resistance: 1x1014Ω/cm
* dielectric strength: 42kV/mm
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Product Stock Unit price Volume discounts -
32,69 €