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SMD-PLCC-Fassungen
• für SMD-Montage (gem. JEDEC MO-047 / MO-025)
• mit dem gleichen Anschluss-Layout wie der Chip
• hochtemperaturfest
• Isolierkörper: Thermoplast,UL94V-0, schwarz
• Kontaktmaterial (DIN17660): CuSn (Phosphor Bronze)
• Kontaktoberfläc...
SMD-PLCC-Fassungen
• für SMD-Montage (gem. JEDEC MO-047 / MO-025)
• mit dem gleichen Anschluss-Layout wie der Chip
• hochtemperaturfest
• Isolierkörper: Thermoplast,UL94V-0, schwarz
• Kontaktmaterial (DIN17660): CuSn (Phosphor Bronze)
• Kontaktoberfläche: verzinnt, bleifrei
• Durchgangswiderstand, max.: 40mΩ
• Nennstrom: 1A
• Isolationsspannung: 250V DC
• Isolationswiderstand, min.: >500MΩ
• Temperaturbereich: -40...+85°C
• kurzzeitig (10s): +260°C
• Lötbarkeit: IEC 68-2-20 Tb
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