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SMD-PLCC-Fassungen
* für SMD-Montage (gem. JEDEC MO-047 / MO-025)
* mit dem gleichen Anschluss-Layout wie der Chip
* hochtemperaturfest
* Isolierkörper: Thermoplast,UL94V-0, schwarz
* Kontaktmaterial (DIN17660): CuSn (Phosphor Bronze)
* Kontaktoberfläc...
SMD-PLCC-Fassungen
* für SMD-Montage (gem. JEDEC MO-047 / MO-025)
* mit dem gleichen Anschluss-Layout wie der Chip
* hochtemperaturfest
* Isolierkörper: Thermoplast,UL94V-0, schwarz
* Kontaktmaterial (DIN17660): CuSn (Phosphor Bronze)
* Kontaktoberfläche: verzinnt, bleifrei
* Durchgangswiderstand, max.: 40mΩ
* Nennstrom: 1A
* Isolationsspannung: 250V DC
* Isolationswiderstand, min.: >500MΩ
* Temperaturbereich: -40...+85°C
* kurzzeitig (10s): +260°C
* Lötbarkeit: IEC 68-2-20 Tb
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